Đăng nhập
 
Tìm kiếm nâng cao
 
Tên bài báo
Tác giả
Năm xuất bản
Tóm tắt
Lĩnh vực
Phân loại
Số tạp chí
 

Bản tin định kỳ
Báo cáo thường niên
Tạp chí khoa học ĐHCT
Tạp chí tiếng anh ĐHCT
Tạp chí trong nước
Tạp chí quốc tế
Kỷ yếu HN trong nước
Kỷ yếu HN quốc tế
Book chapter
Bài báo - Tạp chí
11 (2017) Trang: 2370-2378
Tạp chí: IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences

As devices continue to shrink, the parameter shift due to process variation and aging effects has an increasing impact on the circuit yield and reliability. However, predicting how long a circuit can maintain its design yield above the design specification is difficult because the design yield changes during the aging process. Moreover, performing Monte Carlo (MC) simulation iteratively during aging analysis is infeasible. Therefore, most existing approaches ignore the continuity during simulations to obtain high speed, which may result in accumulation of extrapolation errors with time. In this paper, an incremental simulation technique is proposed for lifetime yield analysis to improve the simulation speed while maintaining the analysis accuracy. Because aging is often a gradual process, the proposed incremental technique is effective for reducing the simulation time. For yield analysis with degraded performance, this incremental technique also reduces the simulation time because each sample is the same circuit with small parameter changes in the MC analysis. When the proposed dynamic aging sampling technique is employed, 50× speedup can be obtained with almost no decline accuracy, which considerably improves the efficiency of lifetime yield analysis.

Các bài báo khác
Số 25 (2013) Trang: 1-7
Tác giả: Nguyễn Cao Quí
Tải về
(2020) Trang: 54–57
Tạp chí: The 3nd International Conference on Electronics, Communications and Control Engineering,Bali, Indonesia, April 8-10, 2020
(2019) Trang: 54-57
Tạp chí: The 2019 2nd International Conference on Electronics, Communications and Control Engineering Phuket, Thailand — April 13 - 16, 2019
58 (2017) Trang: 64-73
Tạp chí: Integration, the VLSI Journal, Elsevier
 


Vietnamese | English






 
 
Vui lòng chờ...